產品介紹∣濺射鍍膜機和熱蒸鍍儀

三靶渦輪泵濺射鍍膜機 DST3-T 是一種多真空鍍膜機系統，它將熱蒸鍍儀和濺射鍍膜機整合在一個緊湊的台式系統中。高真空系統適用於多種材料的沉積。三磁控管靶台濺射鍍膜機可在蒸鍍和濺射狀態（非同時）之間輕鬆切換。

磁控濺射鍍膜機 DST3-T 配備了一個大腔體（直徑 300 mm）和三個直徑2”的水冷陰極，適合長時間沉積。磁控濺射鍍膜機配有射頻和直流電源。它可以濺射半導體、電介質和金屬（氧化性和惰性）靶材。

濺射鍍膜機系統配備了一個自動調節匹配器，可將射頻濺射過程中的反射功率降至最低。為了增加薄膜與基底的附著力並改善薄膜結構，可在基底上施加 300 V 直流偏置電壓（可選）

根據陰極的狀態，DST3-T 有兩種型號：

DST3 – TA (帶角度陰極):
DST3-TA 配備了三個具有共同中心點的角度陰極。濺射鍍膜機系統可同時或單獨從兩個或三個（可選）靶材上進行濺射，以分別形成合金或多層沉積。該模型中基板的最大尺寸可以是 3 英寸。

DST3 -TS（直式陰極）：
DST3-TS 配有三個 2 英寸水冷直式陰極，適合濺射直徑達 20 cm的單一個大型樣品或多個小型樣品

DST3-T濺射鍍膜機的特點

緊湊系統中的濺射和熱蒸鍍的完美工藝。
高真空級別。
配備適用於金屬、半導體和電介質的直流和射頻電源。
帶三個2”水冷角度磁控陰極，適用於生產合金薄膜 (DST3-TA) 和多層沉積。
帶熱源裝置。
兩個固定和可移動的石英晶體監測系統，用於即時厚度測量（1 nm精度）。
兩個精密質量流控制器，用於良好控制氬氣流量和反應性濺射氣體。
手動或自動定時或定厚沉積。
提供GLAD (Glancing Angle Deposition) 濺鍍技術。
等離子清洗。
視覺式的觸控螢幕，可控制濺鍍過程並快速輸入數據。
友善的用戶軟體介面，並可通過網路更新。
Vac coat 產品在全球範圍內都有公共和產品責任保險，以防 Vac coat 系統造成任何財產損失或人身傷害。
可翻轉和改變旋轉樣品架的高度，並可選擇陰極。
500°C基板加熱器（可選）。
300 V DC 基板偏置電壓（可選）。
無限沉積時間，不會破壞真空。

三靶渦輪泵濺射鍍膜機的熱蒸鍍

DST3-T 配備了大電流電源和低電壓（電阻式）熱蒸鍍平台，適合各種熱蒸鍍應用。濺射鍍膜系統可將各種材料可控地熱蒸鍍到基底上。單一個熱源支架上可安裝不同類型的熱蒸鍍源（舟型、籃型與線圈型）。

觸控式螢幕操控

三靶渦輪分子泵濺射鍍膜機配備了 7”彩色觸控螢幕和半自動控制及數據輸入裝置，即使沒有經驗的用戶也能操作。真空和沈積訊息可以在觸控螢幕上以數值資料或曲線的形式顯示。最後 300 次濺鍍資訊都可儲存在歷史紀錄頁上。

濺射鍍膜機樣品架

支架是根據顯微鏡載玻片的常規尺寸製作的，但使用者可以根據需要定製尺寸。在樣品架上有多個夾具，以便在旋轉過程中使用簡單的方法固定小樣品。

濺射鍍膜機應用

金屬、半導體和介質薄膜。
奈米和微電子。
太陽能電池應用。
共濺鍍工藝。
光學元件鍍膜。
薄膜傳感器。
磁性薄膜設備。
電腦記憶體應用。
用於 SEM 和 FE-SEM 樣品製備的細顆粒結構沉積。

High Vacuum Turbomolecular Pump

Pumping Speed	90 l/s	350 l/s
Ultimate Pressure	7×10-6 Torr	7×10-7 Torr

Two-stage rotary vane pump 4 m3/h
Independent sputtering control rate for each cathode to produce fine grain structures
Automatic control of deposition power independent of pressure
Automatic control of the cathode’s temperatures to protect the life time of the magnets
Water-cooled high current electric feedthrough
Two precision Mass Flow Controller (MFC) for fine control of Ar flow and so reactive sputtering gas
Records and plots of coating parameters graphs
Transfers curves and deposition process data by a USB port to PC
300V DC bias voltage (optional)
Equipped to plasma cleaner (optional)
Equipped to 500˚C substrate heater (optional)
DC power supply 0-1200V, 0-500 mA
0-24 V, 0-100 A high current power supply
300 W RF power supply with automatic matching box
Utilities: 220V-240V, 50/60HZ, 16A
Box Dimensions: 50 cm H x 60 cm W x 47 cm D
Shipping Weight: 160 kg (Pump, Rack, and Box)

Options and Accessories

The Triple Target Turbomolecular Pumped Sputter Coater – DST3-T has the following options and accessories:

Quartz crystal sensors
Spare vacuum glass chamber
Sputtering Targets
Thermal source materials
300V DC bias voltage
Plasma cleaner
500˚C substrate heater

The DST3-T, Triple Target Turbo Pumped Sputter Coater, is a multi vacuum coater system that combines thermal evaporator and sputter coater in one single compact desktop system. The high vacuum system is suitable for deposition of a wide range of materials. Triple magnetron target desk sputter coater can easily switch between Evaporation and Sputtering condition (Not Simultaneously).

The DST3-T, Magnetron Desk Sputter Coater, is equipped with a large chamber (300 mm diameter) and three 2” diameter water-cooled cathodes which make it suitable for long time deposition. The magnetron desk sputter coater is equipped with RF and DC power supplies. It can sputter semiconductors, dielectrics and metal (oxidizing & noble) targets.

The sputter coater system is equipped with an auto adjustable matching box, minimizing the reflected power in the RF sputtering process. For increasing film adhesion to the substrate and to improve the film structures, a 300 V, DC bias voltage can be applied to the substrate (optional).

According to state of the cathodes, DST3-T is available in two models:

DST3 – TA (Angled Cathodes):
The DST3-TA is equipped with three angled cathodes with a common focal point. The sputter coater system can sputter from two or three (optional) targets simultaneously or independently to form alloys or multilayer deposition respectively. The maximum size of substrates in this model could be 3 inches.

DST3 –TS (Straight Cathodes):
DST3-TS with three straight 2 inches water-cooled cathodes is suitable for sputtering a single large specimen with diameter up to 20 cm or several small specimens.

Features of DST3-T Sputter Coater

Sputtering and Thermal Evaporation process in a compact system
High vacuum level
Equipped with DC and RF power supplies suitable for metals, semiconductors and dielectrics
Three 2” water-cooled angled, magnetron cathodes suitable for producing alloy films (DST3-TA) and multilayer deposition
One thermal source installation
Two fixed and movable quartz crystal monitoring system for real time thickness measurement (1 nm precision)
Two MFCs
Manual or automatic Timed or Thickness deposition
GLAD Sputtering
Plasma Cleaning
Intuitive touch screen to control coating process and rapid data input
User friendly software that can be updated via network
Vac coat Products are covered worldwide by both public and product Liability Insurance in case any property damage or personal injury happens caused by the Vac Coat systems.
Tillable and change height of rotary sample holder with ability to selection of the cathodes
500 °C substrate heater (optional)
300 V DC substrate bias voltages (optional)
Unlimited deposition time without breaking vacuum

Thermal Evaporation of Triple Target Turbo Pumped Sputter Coater

The DST3-T is equipped with a high current power supply and low-voltage (resistive) thermal evaporation platform suitable for a wide variety of thermal evaporation applications. The sputter coating system allows controlled thermal evaporation of wide range materials onto substrate. Different types of thermal evaporation sources (Boat, Basket, and Coil) can be installed on the single thermal source holder.

Touch Screen Control

Triple Target Turbomolecular Pumped Sputter Coater is equipped with a 7” colored touch screen and semi-automatic control and data input that can be operated by even inexperienced users. The vacuum and deposition information can be observed as digital data or curves on the touch screen. Information of the last 300 coating can also be saved in the history page.

Sputter Coater Sample Holder

The holder is made according to the conventional size of microscope slides, but the user can order customize size according to his/her needs. On the sample holder number of clamps are created to hold the small samples with a simple method during the rotation.

Sputter Coater Applications

Metal, Semiconductor, and Dielectric Films
Nano & Microelectronic
Solar cell applications
Co-Sputtering processes
Optical components coating
Thin film sensors
Magnetic thin film devices
Computer memory applications
Fine grain structural deposition for SEM & FE-SEM sample preparation

High Vacuum Turbomolecular Pump

Pumping Speed	90 l/s	350 l/s
Ultimate Pressure	7×10-6 Torr	7×10-7 Torr

Two-stage rotary vane pump 4 m3/h
Independent sputtering control rate for each cathode to produce fine grain structures
Automatic control of deposition power independent of pressure
Automatic control of the cathode’s temperatures to protect the life time of the magnets
Water-cooled high current electric feedthrough
Two precision Mass Flow Controller (MFC) for fine control of Ar flow and so reactive sputtering gas
Records and plots of coating parameters graphs
Transfers curves and deposition process data by a USB port to PC
300V DC bias voltage (optional)
Equipped to plasma cleaner (optional)
Equipped to 500˚C substrate heater (optional)
DC power supply 0-1200V, 0-500 mA
0-24 V, 0-100 A high current power supply
300 W RF power supply with automatic matching box
Utilities: 220V-240V, 50/60HZ, 16A
Box Dimensions: 50 cm H x 60 cm W x 47 cm D
Shipping Weight: 160 kg (Pump, Rack, and Box)

Options and Accessories

The Triple Target Turbomolecular Pumped Sputter Coater – DST3-T has the following options and accessories:

Quartz crystal sensors
Spare vacuum glass chamber
Sputtering Targets
Thermal source materials
300V DC bias voltage
Plasma cleaner
500˚C substrate heater